APEC INTEGRATED CHIP (ICs)_AP83T03GH-HF TO-252
APEC INTEGRATED CHIP (ICs)_AP83T03GH-HF TO-252 IC CHIP APEC Singapore Distributor, Supplier, Supply, Supplies | Mobicon-Remote Electronic Pte Ltd
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Description

The TO-252 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. The through-hole version (AP83T03GJ) is available for low-profile applications.
Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

 

 

¨‹ Low On-resistance

¨‹ Simple Drive Requirement
¨‹ Fast Switching Characteristic
¨‹ RoHS Compliant & Halogen-Free

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