APEC INTEGRATED CHIP (ICs)_AP83T03GH-HF TO-252
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Description
The TO-252 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. The through-hole version (AP83T03GJ) is available for low-profile applications.Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
¨‹ Low On-resistance
¨‹ Simple Drive Requirement¨‹ Fast Switching Characteristic
¨‹ RoHS Compliant & Halogen-Free